Sika SikaBond T-55J Polyurethane Wood Floor Adhesive

Description

Sika SikaBond T-55J Polyurethane Wood Floor Adhesive
– 16 kg Pail

 

Sika SikaBond T-55J Polyurethane Wood Floor Adhesive is designed for full surface wood floor bonding of solid and
engineered wood floors and subfloors.

 

FEATURES

• Adhesive can be sanded
• Floor can be walked on / sanded after 12 / 24 hours
• Elastic, footfall-sound dampening properties
• Good elasticity
• Suitable for use with underfloor heating
• Suitable for bonding directly onto old ceramic tiles
• Reduces stress transfer between the wood floor and the substrate
• Low VOC content

 

PRODUCT INFORMATION

 

Composition

• Polyurethane

 

Packaging

• 16 kg pail
• 600 ml foil pack, 20 foil packs per box

 

Shelf Life

• SikaBond® T-55 J has a shelf life of 12 months from the date of production, if it is stored properly in
  undamaged, original, sealed packaging, and if the storage conditions are met.

 

Storage Conditions

• SikaBond® T-55 J shall be stored in dry conditions, protected from direct sunlight and at temperatures
  between +5 °C and +25 °C.

 

Appearance and Colour

• Ochre

 

Density

• 1.35 kg/l approx.

 

Service Temperature

• +5 °C to +40 °C

 

APPLICATION INFORMATION

 

Consumption

Full Surface Bonding:

• 600−800 g/m2 with notched trowel B3 (TKB Germany) e.g. for lam parquet, mosaic parquet and industrial
  parquet.
• 700−900 g/m2 with notched trowel B6 (TKB Germany) or SC+ MB (US Standard) e.g. for engineered wood
  strips and planks, lam and mosaic parquet.
• 800−1000 g/m2 with notched trowel B11 (TKB Germany) or P5 (US Standard) e.g. solid wood, engineered
  long-strips and panels, industrial parquet, other residential wood floors and paving, and chipboard.
• For bonding long or wide boards and on uneven substrates, it may be necessary to use a larger notched
  trowel to ensure that a sufficient amount of SikaBond® T-55 J is applied to provide a uniform adhesive bed to
  prevent hollow sections without full surface bond.
• For substrates primed with Sika® Primer MB, the consumption of SikaBond® T-55 J may be reduced.

 

Sag / Flow

• SikaBond® T-55 J spreads very easily whilst maintaining stable trowel
  ridges.

 

Ambient Air Temperature

• >15ºC – <35ºC

 

Relative Air Humidity

• 40% to 70%

 

Substrate Temperature

• During laying and until SikaBond® T-55 J has fully cured, the substrate and ambient temperatures shall
  be between +15 °C and +35 °C, and between +20 °C and +35 °C with underfloor heating.

 

Substrate Moisture Content

Permissible substrate moisture content without underfloor heating:
1. 2.5% CM for cement screeds.
2. 0.5% CM for anhydrite screeds.
3. 3–12% CM for magnetite flooring (depending on the organic content).

Permissible substrate moisture content for use with underfloor heating:

1. 1.8% CM for cement screeds.
2. 0.3% CM for anhydrite screeds.
3. 3–12% CM for magnetite flooring (depending on the organic content).

Note: For all moisture contents, the quality of the substrates and surfaces,
always follow the guidelines of the wood flooring manufacturer.

 

Curing Rate

• 3.0 mm/24 hours approx. (23 °C / 50% r.h.)

 

Skin Time / Laying Time

• 60 minutes approx. (23 °C / 50% r.h.)

 

IMPORTANT CONSIDERATIONS

• SikaBond® T-55 J is only suitable for use by professional wood floor applicators.
• For good workability, the adhesive temperature shall be ≥ +15 °C.
• For proper curing of the adhesive, sufficient ambient humidity / moisture is necessary.
• A preliminary adhesion test is necessary before any application on glazed tiles.
• Before wood floors may be installed in non-insulated areas, such as basements or other areas without a
  damp proof membrane, Sikafloor® EpoCem must be applied and sealed with Sika® Primer MB to control the moisture. For
  detailed instructions, contact our Technical Service Department.
• For use with chemically pre-treated types of wood floors (e.g. those produced or treated with ammonia,
  wood stain, timber preservative) and woods with a relatively high oil content, SikaBond® T-55 J is only to be used
  with the written agreement of our Technical Service Department.
• Do not use on polyethylene (PE), polypropylene (PP), polytetrafluoroethylene (PTFE / Teflon), and other
  similar plasticized synthetic materials.
• Some other floor priming materials can negatively influence the adhesion of SikaBond® T-55 J (pre-
  trials recommended).
• SikaBond® T-55 J is designed as a wood floor bonding adhesive. When laying parquet type wood floors
  without tongued and grooved joints, e.g. mosaic parquet floors, avoid the wood floor adhesive extruding into the
  joints between the wood pieces.
• Avoid contact between any wood surface sealer coatings and adhesive. However, if direct contact with
  the adhesive is unavoidable, then the compatibility must be checked and confirmed before use of any coatings. For
  further information and advice, please contact our Technical Service Department.
• Do not expose uncured SikaBond® T-55 J to alcohol containing products as they may interfere with the
  curing reaction. For further information and advice, please contact our Technical Service Department.

 

CLEANING OF EQUIPMENT

• Clean all tools and application equipment immediately after use with Sika® Remover-208 and/or Sika®
  Colma Cleaner.
• Once cured, residual material can only be removed mechanically.